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  Wire Bonding Island Signal Processing
Part Number: W10-10
Florida RF Labs’ wire bonding islands are an alternative to long wire connectors between components, which produce inductance in the circuit. They offer a location to wire bond without plating the entire PC board with gold. By mounting a wire bonding island between two components being wired together, shorter wire leads may be used, reducing overall parasitics in the circuit. They offer the option of using a tab for easy connection to a circuit. Standard thickness is .015 inches (.38mm). Contact the factory for other thicknesses.
Electrical Specifications
Operating Temperature 
-55 to +150C
 
Material
Substrate 
Alumina
Tab 
Gold Plated

Alternative Parts
W05-07
Application Notes
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RFMW

RFMW is Florida RF Labs full line distributor for North America and South America. Call them for inquires at 1-877-FOR-RFMW (367-7369).

RFMW Ltd. services customers with products from specialized, focused and industry leading RF&MW component manufacturers with strategically profiled inventory. Our close technical working relationship with our suppliers results in the value being passed onto our customer base.

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