Florida RF Labs - Wire Bonding Island - Florida RF Labs’ wire bonding islands are an alternative to long wire connectors between components, which produce inductance in the circuit. They offer a location to wire bond without plating the entire PC board with gold. By mounting a wire bonding island between two components being wired together, shorter wire leads may be used, reducing overall parasitics in the circuit. They offer the option of using a tab for easy connection to a circuit. Standard thickness is .015 inches (.38mm). Contact the factory for other thicknesses.


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	Wire Bonding Island	Signal Processing
	Mounting: Solder

Florida RF Labs’ wire bonding islands are an alternative to long wire connectors between components, which produce inductance in the circuit. They offer a location to wire bond without plating the entire PC board with gold. By mounting a wire bonding island between two components being wired together, shorter wire leads may be used, reducing overall parasitics in the circuit. They offer the option of using a tab for easy connection to a circuit. Standard thickness is .015 inches (.38mm). Contact the factory for other thicknesses.

Electrical Specifications

Operating Temperature

-55 to +150C

Material

Substrate

Alumina

Tab

Gold plated

Product Selection Table

Substrate	length	width	height	part
Alumina	1.270.050	1.778.070	0.381.015	W05-07
Alumina	2.540.100	2.540.100	0.381.015	W10-10

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RFMW

RFMW is Florida RF Labs full line distributor for North America and South America. Call them for inquires at 1-877-FOR-RFMW (367-7369).

RFMW Ltd. services customers with products from specialized, focused and industry leading RF&MW component manufacturers with strategically profiled inventory. Our close technical working relationship with our suppliers results in the value being passed onto our customer base.

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